Welcome - Fraunhofer IZM

High-End Performance Packaging vom Wafer zum System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

News

European Chiplet Innovation: APECS Pilot Line starts Operation in the Framework of the EU Chips Act

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act.

www.apecs.eu

News | December 10, 2024

For high power or the high seas

Innovative sensor designs made possible by glass-integrated waveguides

In the “3DGlassGuard“ project, a consortium including Fraunhofer IZM is working on a sensor for measuring the density of seawater that can potentially help generate more consistent climate models.

mehr info

News | November 27, 2024

A Research Team from ams OSRAM and Fraunhofer Wins the Deutscher Zukunftspreis for Digital Light

Germany’s President Frank-Walter Steinmeier honored the winners of the Deutscher Zukunftspreis 2024 at a formal ceremony in Berlin.

more info

News | November 8, 2024

Visit of the French Minister of Research Patrick Hetzel at Fraunhofer IZM

On November 8, Fraunhofer IZM welcomed Patrick Hetzel, the French Minister of Higher Education and Research. The meeting’s objective was to continue the dialog on future-relevant key technologies such as high-performance computing, quantum electronics, hardware security and sustainability.

more info

News | October 21, 2024

Quick charging electric cars from household power outlets, made possible by innovative transistors

On the EnerConnect project, researchers at Fraunhofer IZM are testing bidirectional blocking gallium nitride (GaN) transistors to design a system that could be used with the next generation of active converters and rectifiers.

more info

News | October 1, 2024

Prof. Ivan Ndip honored with the 2024 IMAPS Outstanding Educator Award

Ivan Ndip has been honored with the 2024 Outstanding Educator Award by the International Microelectronics Assembly and Packaging Society (IMAPS) for his significant contributions to education for the microelectronics packaging industry.

more info

News | September 30, 2024

New simulation models create a faster and more affordable route to market for complex microelectronics

Before they ever hit the market, reliable microelectronic systems need to besubjected to lengthy and cost-intensive qualification tests.

more info

News

Events

Exhibition | March 11 - 13, 2025

Fraunhofer IZM at the embedded world

Embedded world will be coming to Nuremberg from 11 to 13 March 2025. At the world's premier expo for embedded systems, Fraunhofer IZM will be presenting its newest research into sensor packaging, sensor development, and sensor networks at a joint Fraunhofer booth.

more info

Exhibition | May 6 - 8, 2025

Fraunhofer IZM at the Measurement Fair SENSOR+TEST

The International Trade Fair SENSOR + TEST will be taking place in Nürnberg. The trade fair with the concurrent conferences is considered one of the world’s leading events in sensorics, measuring and testing technologies. Fraunhofer IZM presents current research in sensor packaging, sensor development, and sensor networks at a joint Fraunhofer booth.

more info

Exhibition | May 6 - 8, 2025

PCIM Europe

Fraunhofer IZM presents power highlights at PCIM Europe.

The PCIM Europe is the world's leading exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management.

more info

Events

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

www.forschungsfabrik-mikroelektronik.de/en

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Fraunhofer Institute for Reliability and Microintegration IZM

Five years of RealIZM: Challenges of science communication

European Chiplet Innovation: APECS Pilot Line starts Operation in the Framework of the EU Chips Act

For high power or the high seas

A Research Team from ams OSRAM and Fraunhofer Wins the Deutscher Zukunftspreis for Digital Light

Visit of the French Minister of Research Patrick Hetzel at Fraunhofer IZM

Quick charging electric cars from household power outlets, made possible by innovative transistors

Prof. Ivan Ndip honored with the 2024 IMAPS Outstanding Educator Award

New simulation models create a faster and more affordable route to market for complex microelectronics

Launch of the Competence Center Green ICT @ FMD

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging vom Wafer zum System

Departments

News

European Chiplet Innovation: APECS Pilot Line starts Operation in the Framework of the EU Chips Act

For high power or the high seas

A Research Team from ams OSRAM and Fraunhofer Wins the Deutscher Zukunftspreis for Digital Light

Visit of the French Minister of Research Patrick Hetzel at Fraunhofer IZM

Quick charging electric cars from household power outlets, made possible by innovative transistors

Prof. Ivan Ndip honored with the 2024 IMAPS Outstanding Educator Award

New simulation models create a faster and more affordable route to market for complex microelectronics

News

Events

Fraunhofer IZM at the embedded world

Fraunhofer IZM at the Measurement Fair SENSOR+TEST

PCIM Europe

Events

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Research Fab Microelectronics Germany

Fraunhofer IZM annual report & Brochure

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

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