Welcome - Fraunhofer IZM

High-End Performance Packaging vom Wafer zum System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Environmental & Reliability Engineering

RF & Smart Sensor Systems

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

Wafer Level System Integration

System Integration & Interconnection Technologies

News

News | April 15, 2025

600 kilowatts? This inverter knows how to keep its cool!

Power inverters are the beating heart in the drive train of modern electric cars. They turn the electrical energy from the batteries into something that engines can actually use. Fraunhofer IZM has now redefined what this key component is possible of doing.

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News | April 8, 2025

Laser welding brought to quantum technology: Reliable fiber-PIC connections

Researchers at Fraunhofer IZM have developed a laser welding process that works without adhesives to connect Photonic Integrated Circuits (PICs) with optical fibers.

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News | April 1, 2025

Measuring environmental damage with the help of insects

SPAIA - Society of People Against the Insect Apocalypse

In Germany, insect biomass has declined by over 75% in the last 27 years. With SPAIA, Collette Wasielewski and Tom Cox are working on an open-source system to collect insect data globally and protect biodiversity!

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News | March 31, 2025

Major Advancement in Applied Research: FMD Launches the Chiplet Application Hub

On March 31, 2025, at the Hannover Messe, the Research Fab Microelectronics Germany officially unveiled its new Chiplet Application Hub. The Chiplet Center of Excellence is the first cluster of the hub.

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News | February 6, 2025

Innovative molding process for greener tech

The EU Horizon project MULTIMOLD has brought together researchers from Fraunhofer IZM and their international partners in the pursuit of a novel injection molding process that combines advanced electronic functionality with high environmental standards.

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News | January 15, 2025

Fraunhofer IZM is powering the evolution of chiplet technologies as part of the APECS pilot line

The Fraunhofer IZM announces its active contribution to the APECS pilot line launched as part of the EU Chips Acts. APECS intends to promote the development and integration of chiplet technologies.

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News | 23. Dezember 2024

Fraunhofer IZM and Partners Win Gold Medal for Alu4CED

The CORNET project Alu4CED has been awarded the prestigious Gold Medal for Innovation at the Kaohsiung International Invention & Design EXPO (KIDE 2024). The organizers recognized Alu4CED for its innovative contribution to sustainable electronics: a “multifunctional aluminum-based housing for electronic devices in the circular economy.”

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News

Events

Exhibition | May 6 - 8, 2025

Fraunhofer IZM at the Measurement Fair SENSOR+TEST

The International Trade Fair SENSOR + TEST will be taking place in Nürnberg. The trade fair with the concurrent conferences is considered one of the world’s leading events in sensorics, measuring and testing technologies. Fraunhofer IZM presents current research in sensor packaging, sensor development, and sensor networks at a joint Fraunhofer booth.

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Exhibition | May 6 - 8, 2025

PCIM Europe

Fraunhofer IZM presents power highlights at PCIM Europe.

The PCIM Europe is the world's leading exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management.

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Conference | May 27 - 30, 2025

ECTC - 2025 IEEE 75th Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology.

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Events

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.