Events

Photonic integration is driven today by the increasing demand of bandwidth in data- and telecommunication. Furthermore miniaturization in lightening and projection techniques, and a wide variety of optical sensors require new concepts to reduce cost and guarantee reliability. Photonic packaging is crucial and includes single packages, modules or subsystems comprising at least one optoelectronic device or micro-optical element or optical interconnects.

We see that there are many opportunities to be taken by OEM manufacturers, suppliers and service assemblers to face the specific challenges regarding very tight tolerances, photonic system requirements and supply chain management. Thus the Photonics Packaging Workshop at the Fraunhofer Forum Berlin focuses on effective manufacturing strategies in Europe and automated assembly technologies for optoelectronic and photonic integration on board, package and device level.

Online registration here.