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Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM
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WAFER LEVEL SYSTEM INTEGRATION
Key Research Areas
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Departments
Wafer Level System Integration
Key Research Areas
Key Research Areas
Major research areas of the department WLSI:
3D Integration
Wafer Level Packaging and Fine Pitch Bumping
Hermetic MEMS & Sensor Packaging
High Density Assembly
Sensor Development and Integration
Hybrid Photonic Integration
Photonic & Plasmonic Systems
Polymeric interposers based on thin film flex technology
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Fraunhofer Institute for Reliability and Microintegration IZM