Fraunhofer Institute for Reliability and Microintegration IZMProcess and Product Development
Wafer Level System Integration
- New techniques for wafer-level packaging and chip assembly for power electronics
- Polymers for High Density wiring
- Wafer Bonding, Thinning, Thin Wafer Handling
- Permanent Wafer to Wafer Bonding
- Polymers for high-density Wiring
- High-Density Redistribution
- High Density Assembly
- Glass Substrates and Layers
- Sensor Development
- TSV Integration
- TGV Integration
- Hermetic MEMS & Sensor Packaging
- Single Chip Bumping
- Goldstud Bumping
- Thermocompression Bonding
- Interconnect Metallurgy and Processes
System Integration on Flexible and Rigid Substrates
- Flip Chip Adhesive Bond Technologies
- Flip Chip Soldering on Flexible Substrates
- Ultrafine Pitch Soldering on Flexible Substrates
- Ultrathin Solder Interconnections
- Ultrathin Flip Chip Assemblies
- Diebond, Pick and Place
- Die and Wire Bonding for High Frequency Applications
- Conformable Electronics
- Embedding