Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

Working Groups

Heads of Department

Embedding and Substrates

Head:

Lars Böttcher

Dr.-Ing. Andreas Ostmann

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Assembly and Encapsulation

Head:

Karl-Friedrich Becker

Dr. Tanja Braun

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Optical Interconnection Technology

Head:

Dr.-Ing. Henning Schröder

Julian Schwietering

more info

System-on-Flex

Head:

Christine Kallmayer

Malte v. Krshiwoblozki

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Metallic Interconnection Technologies

Head: Dr.-Ing. Matthias Hutter

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Power Electronic Systems

Head: Prof. Eckart Hoene

more info

Technologies for Bioelectronics

Head: Prof. Dr. Vasiliki Giagka

more info