RF & Smart Sensor Systems

The department of RF & Smart Sensor Systems focuses on research and development of application-specific wireless sensor nodes, radar and proximity sensor systems as well as wireless communication and high-performance computing (HPC) modules for a wide range of application fields.

Furthermore, we perform in-depth characterization of electronic packaging technologies, and develop innova-tive designs for RF/high-speed, millimeter-wave (mmWave) and terahertz (THz) packaging.

Our R&D activities concentrate on the following areas:

  • High-frequency Packaging
  • Components and Modules for Communication (e.g. 5G/6G) and Computing
  • Radar and Proximity Sensor Systems
  • Wireless Sensor Nodes and Systems
  • Micro Energy Storage
  • Physical Design Tools and Software

We collaborate closely with industry partners worldwide and provide cost-effective and innovative solutions at every level along the value chain, from materials to systems.

We look forward to welcoming you as our cooperation partner.

Working Groups

The department is structured into eight R&D groups.

Three groups carry out R&D on miniaturized and low-power wireless sensor nodes, energy storage components as well as on physical design tools & software.

Sensor Nodes & Embedded Microsystems / Group Leader: Carsten Brockmann

Physical Design Tools & Software / Group Leader: Bernd Stube

Micro Energy Systems / Group Leader: Dr. Robert Hahn

Three groups carry out R&D on RF packaging as well as on high-frequency components, modules and systems for sensing, communication and computing, thereby covering the entire value chain of the respective applications, from materials to systems.

Communication Module Development / Jens Schneider

Radar Frontends & Modules / Group Leader: Dr.-Ing. Christian Tschoban

Branch Lab, High Frequency Sensors & High-Speed Systems / Head: Prof. Dr.-Ing. habil. Ivan Ndip