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Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM
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Manufacturing & Prototyping
Manufacturing & Prototyping
Wafer Level System Integration
Fine-pitch Bumping for Pixel Detectors
High-Density Redistribution
Wafer Bonding, Thinning, Thin Wafer Handling
Permanent Wafer to Wafer Bonding
Polymers for high-density Wiring
High Density Assembly
Glass Substrates and Layers
Sensor Development
TSV Integration
TGV Integration
Fabrication of nanoporous gold Deposits
Single Chip Bumping
Gold Stud Bumping
Thermocompression Bonding
System Integration & Interconnection Technologies
Chip on board
Diebond, Pick and Place
Die and Wire Bonding for High Frequency Applications
Wire Bonding
Die bond soldering
http://www.izm.fraunhofer.de/en/abteilungen/system_integrationinterconnectiontechnologies/leistungsangebot/prozess-_und_produktentwicklung/die_bond_soldering.html
Balling for SiP / Balling for Interposer
Design, simulation and integration of heat spreaders
Start-a-Factory
Photonics
Fiber lensing
Adhesive-free coupling of glass fibers and capillaries by laser welding
Technologies for Bioelectronics
Deposition & Structuring of Biocompatible Polymers
Deposition & Structuring of Thin-Film Metals and ALD-Ceramics
Assembly of Microelectronic Components on Flexible & Rigid Substrates