Fraunhofer Institute for Reliability and Microintegration IZMManufacturing & Prototyping
Wafer Level System Integration
- Fine-pitch Bumping for Pixel Detectors
- High-Density Redistribution
- Wafer Bonding, Thinning, Thin Wafer Handling
- Permanent Wafer to Wafer Bonding
- Polymers for high-density Wiring
- High Density Assembly
- Glass Substrates and Layers
- Sensor Development
- TSV Integration
- TGV Integration
- Fabrication of nanoporous gold Deposits
- Single Chip Bumping
- Gold Stud Bumping
- Thermocompression Bonding
System Integration & Interconnection Technologies
- Chip on board
- Diebond, Pick and Place
- Die and Wire Bonding for High Frequency Applications
- Wire Bonding
- Die bond solderinghttp://www.izm.fraunhofer.de/en/abteilungen/system_integrationinterconnectiontechnologies/leistungsangebot/prozess-_und_produktentwicklung/die_bond_soldering.html
- Balling for SiP / Balling for Interposer
- Design, simulation and integration of heat spreaders