Environmental & Reliability Engineering

Thermomechanicallife-time models are required for a simulation-based "Design for Reliability". The basis is provided by combined, accelerated stress tests in combination with simulations and modern analysis and optimisation processes.

The reliability of electrical, electronic and mechatronic systems require a comprehensive consideration of products, production processes and business processes. Therefore expertise and management knowledge need to be applied, together with suitable management tools/methodologies.

Investigate moisture-based failures of electronics such like corrosion or migration damage.

The prediction and calculation of failure rates and lifetimesof electronic systems due to ageing and overload requires a top-down evaluation of the reliability of entire systems. The system includesthe superordinate system, sub-systems, the components and connection technologies.Therefore it is necessary to take the environmental conditions and intrinsic interactions into account.

Step by step towards sustainable innovation within the ICT value chain.

The Environmental evaluation and eco-design group is working on the methodology of the evaluation and environmental optimisation of electronic products.

The requirements of environmental legislation can place considerable demands on product development, but they can also open up market opportunities for forward-looking companies.

The use of a digital twin of mechatronic systems enables design optimizations, virtual tests and validations during the development phase as well as continuous monitoring during operation. By integrating trustworthy data sources, the the- oretical behavior of the digital twin or the assembly-specific digital fingerprint is analyzed and compared with the real application.

Quality assurance of power electronics is an essential factor in product reliability. The active power cycling test provides instant lifetime data for power modules.

Electrochemical characterization of materials and their composites with regard to their corrosion behavior depending on the electrolyte exposure occurring in the application.

Vibrationmeasurement and testwith electronic components, if required in combination with humidity and temperature loads. Contactless vibration measurements withlaser vibrometer. In-situ monitoring of the failure of electronic components.

Mechanical forces, temperature changes and moisture effects can impair reliability considerably. For successful optimisation of the reliability of complex systems inthe micro/nano range it is necessary to have knowledge about the failure behaviour of materials and of damage development.

Increased demands on the robustness and durability of electronic components, as well as increasingly short innovation cycles mean that development methods are required which can lead to a reliable overall system in a short time. The use of simulation models offers the opportunity to visualise interrelationships.