Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

Product Development Consultation

Design assessment and optimisation for reliability

© Fraunhofer IZM
Trendgrafik (Response Surface) für die Maximaltemperatur in einem Leistungshalbleiter für unterschiedliche Dicken des Klebers und des Leadframes

Already in the early stages of the design process for a new product, FEM analysis can be used to compare alternatives quickly and to optimise the design in terms of reliability and durability. When selecting suitable technologies for a new product, FEM makes it possible at an early stage to take into account the effects of the production process itself and of use over the operating life of the product.

The emphasis is on thermal and thermo mechanical simulations, in part superimposed with vibrations and purely mechanical stresses. Careful thermal management can result in reliable operations even under increased ambient temperatures. Avoiding excitations at eigen-frequencies is important in order to ensure reliable operations in settings with increased exposure to vibrations.

Tools such as OptiSLang make it possible to identify key influences and to optimise the design in terms of a number of factors. Parameters for models and material data can be used in order to compare and evaluate many options quickly and cost-effectively. Even in short development phases it is then possible to develop product technologies which are efficient in terms of function, environmental conditions, size, weight and reliability requirements.

More services relating to Design assessment and optimisation for reliability

Mechanical and thermal characterisation of materials

Determining mechanical and thermal parameters for materials for microsystem technology. Allowing for environmental conditions (e.g. humidity and temperature). Also determining parameters for the smallest samples and thin layers.
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Reliability evaluation with FEM

Using FEM analysis, interconnection technologies and complex packages can be evaluated and optimised in terms of production quality, and reliability and lifetimeuse.
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Thermal management

Minimising the thermal resistance of packages by the design and optimisation of cooling concepts, taking into account high power losses, heat flux,and ambient temperatures.
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Thermal characterisation

Temperature measurements on assemblies with IR thermography and sensors e.g. to measure temperature distribution, hot spot temperatures, and thermal resistance and impedance.
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Vibration measurements and tests

A robust design for high vibration exposure requires an understanding of eigen-frequencies, natural modes and damping of electronic systems. Test objects range from minute structures (e.g. 400 µm bond wire) to components measuring up to 200 mm x 200 mm. The measurements and tests can be carried out at defined temperatures and humidity.
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