Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

Key Research Areas

3D packaging on component level

To satisfy microelectronics needs for higher integration density in the future, there will be the need to go beyond planar integration of...
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Reliability, evaluation, tests and optimization

Accelerated tests can be used in order to simulate the thermal, climatic and mechanical field stress of electronic assemblies. In combination with FEM- calculation a life-time prediction can be derived. Failure analysis can be used for optimization of material choice and/or technology.

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Photonic packaging

Fraunhofer IZM’s research into photonics for communication and sensor systems, in which we combine optoelectronics and microoptics, has a three-fold...
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© Fraunhofer IZM | Volker Mai

Power electronics and packaging development

 

© Fraunhofer IZM

Wearable and conformable electronics

 

© Fraunhofer IZM | Volker Mai

Panel Level Packaging for System-in-Package

 

© Fraunhofer IZM

Technologies for bioelectronics