To satisfy microelectronics needs for higher integration density in the future, there will be the need to go beyond planar integration of components/functional blocks on wafer or module level – the third dimension is and will be the next big thing in electronic packaging …
Accelerated tests can be used in order to simulate the thermal, climatic and mechanical field stress of electronic assemblies. In combination with FEM- calculation a life-time prediction can be derived. Failure analysis can be used for optimization of material choice and/or technology.
Fraunhofer IZM’s research into photonics for communication and sensor systems, in which we combine optoelectronics and microoptics, has a three-fold aim: miniaturization, improving efficiency and increasing functionality.
Fraunhofer Institute for Reliability and Microintegration IZM