Assembly and Encapsulation

We research integration technologies for system-in-package products, focusing in particular on device assembly for highly integrated packages and joining/encapsulation processes based on polymeric materials. Our technology portfolio includes pick-and-place processes – also for large-area substrates and 3D assemblies – and a wide variety of encapsulation processes, from dispensing and jetting to transfer and compression molding. Material, process and device analyses complete our range of expertise.

Key Research Areas

Panel-level packaging

Developing demands and the market show two main trends helping to shape the ongoing development of system integration technologies. First of all is an ongoing increase in the number of functions directly included in a system — such as electrical, optical, mechanical, biological and chemical processes — combined with the demand for higher reliability and longer system lifetime. Second is the increasingly seamless merging of products and electronics, which necessitates adapting electronics to predefined materials, forms and application environments.

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Fan-out wafer- panel level packaging

Cost-effective and individualized advanced electronic packaging in small batches now available
© Fraunhofer IZM | Volker Mai

Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. FOWLP has a high potential for significant package miniaturization concerning package volume but also its thickness. Technological core of FOWLP is the formation of a reconfigured molded wafer combined with a thin film redistribution layer to yield an SMD-compatible package.

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PLP - A cost effective packaging platform for heterogeneous integration

Developing demands and the market show two main trends helping to shape the ongoing development of system integration technologies. First of all is an ongoing increase in the number of functions directly included in a system — such as electrical, optical, mechanical, biological and chemical processes — combined with the demand for higher reliability and longer system lifetime. Second is the increasingly seamless merging of products and electronics, which necessitates adapting electronics to predefined materials, forms and application environments.

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Networking with Science and Industry

Panel Level Packaging Consortium

Publica

Publications

Here you can find further literature on the topic of Assembly and Encapsulation.