This year Fraunhofer IZM’s Dr. Tanja Braun received the "Sydney Stein Award" in recognition of not only her leadership in the microelectronics packaging industry, but also her significant technical contribution on an international level. The International Microelectronics and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies. Every year IMAPS honors various members with "Society Awards" for remarkable work.

Dr. Braun is an internationally renowned expert on fan-out wafer level packaging and was closely involved in the initiation and organization of the Panel Level Consortium with 17 industry partners, led by Fraunhofer IZM. Earlier this year she already received the IEEE „Exceptional Technical Achievement Award“ as a recognition of her exceptional work in the field of microelectronic packaging,