Welcome - Fraunhofer IZM

High-End Performance Packaging vom Wafer zum System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

News

News | November 8, 2024

Visit of the French Minister of Research Patrick Hetzel at Fraunhofer IZM

On November 8, Fraunhofer IZM welcomed Patrick Hetzel, the French Minister of Higher Education and Research. The meeting’s objective was to continue the dialog on future-relevant key technologies such as high-performance computing, quantum electronics, hardware security and sustainability.

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News | October 21, 2024

Quick charging electric cars from household power outlets, made possible by innovative transistors

On the EnerConnect project, researchers at Fraunhofer IZM are testing bidirectional blocking gallium nitride (GaN) transistors to design a system that could be used with the next generation of active converters and rectifiers.

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News | October 1, 2024

Prof. Ivan Ndip honored with the 2024 IMAPS Outstanding Educator Award

Ivan Ndip has been honored with the 2024 Outstanding Educator Award by the International Microelectronics Assembly and Packaging Society (IMAPS) for his significant contributions to education for the microelectronics packaging industry.

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News | September 30, 2024

New simulation models create a faster and more affordable route to market for complex microelectronics

Before they ever hit the market, reliable microelectronic systems need to besubjected to lengthy and cost-intensive qualification tests.

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Award | September 13, 2024

IEEE ESTC 2024 Best Poster Award goes to Nyake Gahein-Sama

We are very pleased to announce that our colleague Nyake Gahein-Sama won the Best Poster Award at this year’s IEEE Electronics System Integration Technology Conference (ESTC 2024) in Berlin.

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News | September 3, 2024

ITRI-Chairman visits Fraunhofer IZM

High-ranking visitor from Taiwan: Prof. Tsung-Tsong Wu, Chairman of the Industrial Technology Research Institute (ITRI), met with the Institute Director, Prof. Ulrike Ganesh, and representatives of the Research Fab Microelectronics Germany (FMD) at Fraunhofer IZM. The meeting focused on the strategic direction and future cooperation between the two leading research institutes.

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News | August 01, 2024

Leadership duo will shape the future strategy of Fraunhofer IZM

The Fraunhofer Institute for Reliability and Microintegration IZM is proud to announce the appointment of Professor Dr Ulrike Ganesh as its Co-Director. Starting on 01 August 2024, she will join Professor Martin Schneider-Ramelow in shaping the strategic direction of the Institute.

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News

Events

Conference | November 19 - 21, 2024

Fraunhofer IZM hosts E-Textiles Conference 2024 in Berlin!

In 2024, the E-Textiles Conference will be hosted by Fraunhofer IZM in Berlin. The conference will take place from the November 19 – 21, 2024 at the Fraunhofer Forum, the Fraunhofer Society’s conference center in the heart of Berlin, close to Alexanderplatz, the Berlin Cathedral, the Museum Island and many other landmarks of the German capital.

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Expert Session Series | October 22 - December 03, 2024

»Advanced Substrates beyond PCB«

The great diversification of application scenarios leads to more highly integrated substrates in order to match a wide variety of requirements.

With our online sessions, we want to shed light on various areas of application and technical approaches to this topic.

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Green ICT Online-Seminar | November 27, 2024

»Sustainability in Information and Communication Technologies«

In the talk, we will lift the veil on the invisibles of the digital world. Based on the assessed impacts of ICT, we will question the merits of certain technological choices made in the name of the transition.

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Events

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

www.forschungsfabrik-mikroelektronik.de/en

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Fraunhofer Institute for Reliability and Microintegration IZM

Visit of the French Minister of Research Patrick Hetzel at Fraunhofer IZM

Reliable Electronics through Split Manufacturing

Quick charging electric cars from household power outlets, made possible by innovative transistors

Prof. Ivan Ndip honored with the 2024 IMAPS Outstanding Educator Award

New simulation models create a faster and more affordable route to market for complex microelectronics

ITRI-Chairman visits Fraunhofer IZM

Leadership duo of Professors Ulrike Ganesh and Martin Schneider-Ramelow will shape the future strategy of Fraunhofer IZM

Launch of the Competence Center Green ICT @ FMD

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging vom Wafer zum System

Departments

News

Visit of the French Minister of Research Patrick Hetzel at Fraunhofer IZM

Quick charging electric cars from household power outlets, made possible by innovative transistors

Prof. Ivan Ndip honored with the 2024 IMAPS Outstanding Educator Award

New simulation models create a faster and more affordable route to market for complex microelectronics

IEEE ESTC 2024 Best Poster Award goes to Nyake Gahein-Sama

ITRI-Chairman visits Fraunhofer IZM

Leadership duo will shape the future strategy of Fraunhofer IZM

News

Events

Fraunhofer IZM hosts E-Textiles Conference 2024 in Berlin!

»Advanced Substrates beyond PCB«

»Sustainability in Information and Communication Technologies«

Events

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Research Fab Microelectronics Germany

Fraunhofer IZM annual report & Brochure

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

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