Fraunhofer IZM at the Measurement Fair SENSOR+TEST

Nürnberg Messe / May 06, 2025 - May 08, 2025

Fraunhofer IZM at the Measurement Fair SENSOR+TEST

Hall 1, Booth 1-317

Fraunhofer IZM presents innovative hardware concepts and energy-efficient solutions for highly miniaturized sensor systems (Green ICT) as well as current research results in the field of advanced packaging and system integration for smart systems.

Get to know our experts from the RF & Smart Sensor Systems and Wafer Level System Integration departments and exchange experiences.

Plug & play platforms for wireless sensors and radar sensors

Energy efficiency and ecological hardware design play a key role in the development and implementation of self-sufficient embedded systems, sensor nodes and networks for use in smart farming, smart factory and smart city applications.

Fraunhofer IZM is presenting two plug & play sensor platforms that can be used to quickly test and validate concept ideas for wireless sensors and radar sensors. Thanks to standardized interfaces and the Lego principle for configuration steps, modules and assemblies, the time-consuming individual configuration of sensors and data evaluation is no longer necessary.

Funksensorplattform — © Fraunhofer IZM | Volker Mai
Modular platform: The current platform version Swarmy-V2 records measurement data and can flexibly adapt its measurement direction.

IIoT wireless sensor platform: The "SWARMY" sensor-actuator platform enables modular sensor setups for a variety of common measured variables, including wireless interfaces, evaluation and display. The platform is designed for industrial environments.

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Kamera, Radar, Modul — © Fraunhofer IZM | Volker Mai
Radar-Module

Construction kit for plug & play radar: A universal radar platform for 24, 60 and 79 GHz applications is available for the efficient implementation of radar projects. Ranges from 0.1 to 260 meters and angular resolutions of less than 10° are possible.

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High-End Performance Packaging

Sensor-Plattform zur Zustandsüberwachung — © Fraunhofer IZM | Volker Mai
Sensor platform for condition monitoring

© Fraunhofer IZM | Volker Mai
X-Ray Modules

Fraunhofer IZM is a leader with extensive know-how in the production of high-density flexible or rigid-flex multilayer circuits. By demonstrating a flow sensor for condition monitoring with embedded sensors in rigid/flex technology, the application of wafer level redistribution technology on temporary carrier wafers will be presented.

For synchrotron radiation experiments and X-ray imaging applications, hybrid pixel detector modules are the top class in X-ray cameras. Using an X-ray detector in USB stick format, the department »Wafer Level System Integration« will demonstrate their competence in packaging of such hybrid pixel detector systems.

The following exhibits will also be on display:

X-Ray Imaging: CdTe Sensor Module | Download Datasheet [ PDF 0,5 MB ]
Infra-Red Imaging: Micro Bolometer Module and Wafer | Download Datasheet [ PDF 1,1 MB ]
Pressure Sensors
High Density Flex with embedded IC/Sensors: Modules and Wafer
- Fabrication of Flexible High Density Multi-Layer Substrates |
  Download Datasheet [ PDF 0,4 MB ]
- Flex or Rigid-Flex Circuits with Embedded ICs or Sensor Devices |
  Download Datasheet [ PDF 0,4 MB ]
Wafer Level MEMS Packaging: Timing Module | Download Datasheet [ PDF 0,4 MB ]
FanOut WLP: USEP Module | Download Datasheet [ PDF 0,4 MB ]

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Nürnberg Messe / May 06, 2025 - May 08, 2025