RF & Smart Sensor Systems

The department of RF & Smart Sensor Systems focuses on research and development of application-specific wireless sensor nodes, radar and proximity sensor systems as well as wireless communication and high-performance computing (HPC) modules for a wide range of application fields.

Furthermore, we perform in-depth characterization of electronic packaging technologies, and develop innova-tive designs for RF/high-speed, millimeter-wave (mmWave) and terahertz (THz) packaging.

Our R&D activities concentrate on the following areas:

High-frequency Packaging
Components and Modules for Communication (e.g. 5G/6G) and Computing
Radar and Proximity Sensor Systems
Wireless Sensor Nodes and Systems
Micro Energy Storage
Physical Design Tools and Software

We collaborate closely with industry partners worldwide and provide cost-effective and innovative solutions at every level along the value chain, from materials to systems.

We look forward to welcoming you as our cooperation partner.

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Key Research Areas

The key R&D areas in the department are as follows:

High-frequency packaging
- Measurement and characterization of packaging materials, processes and interconnects in dependency on frequency (up to 500 GHz), temperature (-40°C to 200°C), humidity and aging
- Design and optimization of application-specific RF packaging platforms (e.g, AiP/AoP) for heterogeneous system-integration of active devices (SiGe, GaAs, GaN, …), antennas and passive components
- Investigation of novel metamaterial concepts for application-specific RF packages and components
Components and modules for communication and computing
- Development of application-specific antenna arrays, energy-efficient frontend modules and active antenna systems for the following:
  - Mobile communication network infrastructure (e.g. base stations for RAN) and wireless interface of end devices and systems in vertical applications, e.g. for 5G & 6G connectivity
  - Satellite communication (LEO, MEO, GEO), considering earth stations and space segments
- System-level signal and power integrity driven design, measurement and optimization of high-speed interposers, boards and modules in accelerator cards for high-performance computing (HPC), artificial intelligence (AI) and Big Data workloads
Radar and proximity sensor systems
- Design, integration and middleware development of novel radar sensors (including AI-signal processing) for automotive, logistic, transportation and home automation applications
- Development of cost-effective, miniaturized and application-specific radar and proximity sensor systems for medical & healthcare, industrial automation, smart farming and security applications
Wireless sensor nodes and systems
- Low power system design of energy autarkic wireless sensor nodes for smart farming, industrial automation and smart city applications
- Implementation of hardware based AI-algorithms for data preconditioning
- Leading edge wireless sensor nodes-based monitoring system for overhead power lines
- Collective intelligence in decentralized and distributed systems
Micro energy storage
- Development of micro batteries for ultra-miniaturized medical applications & energy autarkic sensors
- Materials development for micro batteries: solid state electrolytes and novel battery packaging
- Hydrogen storage in galvanic Zinc cells and Ni-Zn rechargeable batteries
Physical design tools & software
- Machine learning algorithms for Big Data applications
- Planning tools for IoT-Systems
- Development of add-on layout tools considering EMC, thermal and RF requirements

Services

We offer R&D services in the following areas:

Feasibility studies for application-specific development of new microelectronic components, modules and systems
Provide consulting services on emerging and future technologies (e.g. 5G, 6G, THz sensing, …) to industries (SMEs and large companies) as well as to municipalities, state and federal agencies
Wireless sensor nodes & systems
- Low-power system design (hardware & software) and integration of energy autarkic wireless sensor nodes for the following application fields:
  - Smart farming, smart factory and smart city
  - Monitoring of overhead power lines
- Development of proprietary protocols for wireless sensor nodes
- Implementation of edge AI algorithms for data preconditioning
- Power supply and energy management in microelectronic systems
- Design and Development of scalable decentralized systems
Radar and proximity sensor systems
- Design, integration and middleware development of novel radar sensors (including AI-signal processing) for automotive, logistic, transportation and home automation applications
- Development of cost-effective, miniaturized and application-specific radar and proximity sensor systems for medical & healthcare, industrial automation, smart farming and security applications
Components and modules for communication and computing
- Development of application-specific antenna arrays, energy-efficient frontend modules and active antenna systems for the following:
  - Mobile communication network infrastructure (e.g. base stations for RAN) and wireless interface of end devices and systems in vertical applications, e.g. for 5G & 6G connectivity
  - Satellite communication (LEO, MEO, GEO) considering earth stations and space segments
- System-level signal and power integrity driven design, measurement and optimization of high-speed interposers, boards and modules in accelerator cards for high-performance computing (HPC), artificial intelligence (AI) and Big Data workloads
High-frequency packaging
- Measurement, characterization and analysis of packaging materials and processes in dependency on frequency (up to 500 GHz), temperature (-40°C to 200°C), humidity and aging
- Design, measurement and optimization of packaging interconnects up to 500 GHz
  - Chip interconnections (e.g. bond wires, flip-chip interconnects), transmission lines and vias
  - Package-to-board and board-to-board interconnects (e.g. BGA balls, sinter interconnects)
  - RF connectors
Micro energy storage
- Design and prototype fabrication of customized micro batteries with application specific dimensions, temperature, voltage and power range
- Battery testing service and consulting
- Electrochemical testing of novel battery systems
Physical design tools & software
- Planning tools for IoT-Systems
- Development of add-on layout tools considering EMC, thermal and RF requirements
- Database systems for processing data from sensor networks
- Provision of client-server architectures for data analysis

Equipment

Advanced System Engineering Lab

The Advanced System Engineering Laboratory comprises several electrotechnical laboratories, each featuring cutting-edge equipment and a wide range of industry-standard design tools. We provide comprehensive support with state-of-the-art tools for the application areas related to our three areas of research.

High-Frequency Technology - Equipment and Tools

Microsystem Technology - Equipment and Tools

Micro Battery Line

Working Groups

The department is structured into eight R&D groups.

Three groups carry out R&D on miniaturized and low-power wireless sensor nodes, energy storage components as well as on physical design tools & software.

Sensor Nodes & Embedded Microsystems / Group Leader: Carsten Brockmann

Physical Design Tools & Software / Group Leader: Bernd Stube

Micro Energy Systems / Group Leader: Dr. Robert Hahn

Three groups carry out R&D on RF packaging as well as on high-frequency components, modules and systems for sensing, communication and computing, thereby covering the entire value chain of the respective applications, from materials to systems.

Communication Module Development / Jens Schneider

Radar Frontends & Modules / Group Leader: Dr.-Ing. Christian Tschoban

Branch Lab, High Frequency Sensors & High-Speed Systems / Head: Prof. Dr.-Ing. habil. Ivan Ndip