Wafer Level System Integration

2.5/3D Technologies

• TSV Integration
• Silicon interposer TSV first
  • TSV via middle
  • TSV via last
  • Device stack

• Glass interposer and TGV Integration
• 2.5/3D Interposer
  
• Backside Interconnects
• 3D Stack Formation
• Flexible High Density Multi-Layer Substrates
• Polymeric interposers based on thin film flex technology

High Density Redistribution

• High Density Redistribution
• Multi-layer Redistribution
  
• Polymers for high-density Interconnects
• Copper/Polymer Evaluation Kit
• Integration of passive devices
  
• Glass substrate and layers
  
• Fan-out Wafer-Level Packaging
• High-Density-Routing (RDL)

Wafer-Bumping

• Wafer Bumping via Electroplating
• Solder & pillar bumps
• Fine-pitch bumping for Pixel Detectors
• Fabrication of nanoporous old Structures
  
• Mechanical gold stud bumping
• Single chip bumping
• Electro chemische deposition

Wafer-Bonden

• Permanent wafer-to-wafer bonding
• Temporary wafer bonding for thin wafer handling
  
• Wafer level capping

Thinning/Singulation/Dicing

• Back grinding tape lamination
• Wafer backgrinding
• Polishing
• mechanical blade dicing
• laser grooving
• laser stealth dicing
• wafer edge trimming

High-Density Assembly

• Fine pitch assembly for pixel detectoren
• Detector packaging for medical x-ray imaging and x-ray crystallography
• Interconnect metallurgy and processes
  
• Thermo compression bonding
• Chip-Stacking
• Fine-pitch flip chip (FC) assembly & die bonding
• Wafer-level solder ball attach (100 – 500 μm)
• Evaluation of low-temperature assembly technologies
  
• Evaluation of flux free solder connections with self alignment capability
  
• Reliability investigation of flip chip interconnections
• Chip to Wafer Assembly

Failure Analysis & Reliability Investigation

• Metrology: Bump heights / TSV depth measurement, defect inspection, topology, layer thickness, wafer thickness & bow/ warp (VIS), wafer thickness (infrared), die warpage measurement, physical failure analysis, preparation techniques 3D stack
• FIB / REM imaging
• Copper/polymer evaluation kit - Interdigital finger-type capacitors

Sensor Development

• Sensor design
• Reliability and lifetime optimization
  
• Standard and customer-specific packaging with integrated sensor data processing e.g. TO8,  packages with  media separation, molding
• Characterization of pressure (10 m-100 Bar), gas and acceleration sensors (up to 40 g)
• Planar technologies (SiO, SIN deposition, Sputtering)
• Overview sensor activities

Photonic & Plasmonic Systems

• Photonic & Plasmonic Simulation