Fraunhofer IZM has achieved another important milestone in its commitment to qualified customer-specific process development: The International Certification Group (ICG) confirms that the quality management system of the "Wafer Level System Integration" (WLSI) department is in accordance with the standard DIN EN ISO 9001:2015 and has been officially certified for “Research, development, and services in electronic packaging”.

The department "Wafer Level System Integration" (WLSI)  specializes in developing advanced packaging and system integration technologies on wafer level, thus being able to offer customer-specific solutions for microelectronic products in the overall scope of smart system integration.