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Fraunhofer Institute for Reliability and Microintegration IZM
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Technology Information
Technology Information
Data sheet flex or rigid-flex Circuits (2024) [ PDF 0.46 MB ]
Data sheet Flexible Multi-layer Substrate (2024) [ PDF 0.5 MB ]
Data sheet WL-MEMS Packging (2023) [ PDF 0.43 MB ]
Data sheet Copper Polymer Kit (2023) [ PDF 0.52 MB ]
Data sheet Detector Packaging for X-Ray (2023) [ PDF 0.57 MB ]
Data/project sheet MEMS-based IR imaging sensor chips_APPLAUSE (2023) [ PDF 1.14 MB ]
Data sheet LIDAR Sensors 3D SiP (2019) [ PDF 0.14 MB ]
Data sheet CarrICool (2019) [ PDF 0.23 MB ]
Data sheet NaLaSysPro (2019) [ PDF 0.18 MB ]
Data sheet Testchip Design-ASSID (2018) [ PDF 0.29 MB ]
Data sheet Wafer Level Packaging of Power Devices (2018) [ PDF 0.17 MB ]
Data sheet TMR Position Sensor Module (2018) [ PDF 0.19 MB ]
Project sheet USeP (2023) [ PDF 0.42 MB ]
Data sheet Hermetic Wafer Level Packaging of LED Modules (2018) [ PDF 0.15 MB ]
Data sheet 3D Hybrid Pixel Detector Module (2017) [ PDF 0.16 MB ]
Data sheet TSV into CMOS integration (2017) [ PDF 0.14 MB ]
Info brochure Silicon Microsensors (2016) [ PDF 1.06 MB ]
Data sheet Wafer-Level Device Capping (2015) [ PDF 0.22 MB ]
Data sheet Thin Wafer Handling (2015) [ PDF 0.18 MB ]
Overview ASSID - japanese [ PDF 0.36 MB ]
Fraunhofer Institute for Reliability and Microintegration IZM