Projects - Fraunhofer IZM

Projects

3D Integration for quantum computing

TO.QI (2024-2027)

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Projects

New data transmission technologies for computer tomographs

SEMECO A1 (2023-2026)

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Projects

A multi-hub Test and Experimentation Facility for edge AI hardware

Prevail (2023-2025)

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Projects

Quantum Computer in the Solid State

Q-Solid (2022-2026)

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Projects

Split Manufacturing of novel and trustworthy Electronics

T4T (2022-2025)

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Projects

Trustworthy Complex Systems with WL Packaging

VE-REWAL (2021-2024)

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Projects

Packaging/Interconnection for Microelectronic & Optoelectronic Systems

Applause (2019-2022)

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Projects

Assembly/Test for next gen. 800G & 1.6 T transceivers

MASSTART (2019-2021)

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Projects

Revolutionary Sensor Platform for future IoT systems

USeP (2017-2021)

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Projects

Production Lines for Chip Realization with MtM-Technologies

ADMONT (2015-2019)

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Projects

Si-Photonik-Matrix for low power/low cost data centers

L3MATRIX (2015-2019)

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Projects

Wireless Localization of Systems in Production and Assembly Lines

NaLoSysPro (2015-2018)

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Projects

Optical data transmission on-board, board-to-board, rack-to-rack

PhoxTroT (2012-2017)

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Projects

MtM Component Implementation into Modular Interposers

CarrICool (2014-2016)

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Projects

μ-structured luminous Diodes for innovative adaptive Headlights

µAFS (2013-2016)

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Projects

3D Process Technology for innovative 3D-SiP Solutions

Master_3D (2012-2016)

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Projects

Wafer-level Fabrication of a MEMS Package

Go4Time (2010-2014)

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Projects

Gold TSV Technology

PARADIGM (2010-2014)

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Projects

Research Network "Functional Integration in Micro and Nanoelectronics"

Fraunhofer, TU Dresden and TU Chemnitz cluster their competencies in the fields of micro / nano electronics. Research know-how will – in close cooperation with resident companies – be extended and innovations can be implemented more quickly into applications and products.