Failure-corrected Quantum Computer based on superconductive quantum Processors

Quantum Computer in the Solid State - QSolid

The joint project »Quantum computer in the solid state – Qsolid« with a duration of 5 years started on January 1st, 2022 under the leadership of the project partner Forschungszentrum Jülich (FZJ). The overall goal is the development of a more failure-corrected quantum computer based on superconductive quantum processors as well as its early integration into the existing supercomputer infrastructure at FZJ. A first demonstrator is planned to come on stream in 2024 and to be available for early tests of applications as well as benchmark investigations. In the further course of the project, the extension to a multi-processor machine is planned that will allow the use of different next generation superconductive quantum processors.

The participating research institutions and companies stand for all significant elements that are needed for the value chain of quantum computers and thus prepare the commercialization of the leading-edge technology. Besides the concentration on the improvement of the Qubit quality, material, design, process and system development, the characterization at low temperatures as well as the software connection to existing super computers are major research aspects within this projects.

Fraunhofer IZM is involved in the work package »technologies for hardware integration«, specifically in the task »cryogenic packaging«. Together with the project partner GlobalFoundries, Fraunhofer IPMS and the Forschungszentrum Jülich, investigations on the co-integration of Qubit as well as control/readout electronics is performed. Major aspects here are the thermal management/thermal decoupling, the realization of high-density superconductive wiring and contact structures as well as the mounting of Qubits and CMOS-ICs.
Additionally, the Qubit »isolation« and the scalability of the packaging solutions are of main importance. It is planned to modify and characterize the Si-interposer technologies that are being developed by Fraunhofer IZM-ASSID to match the previously listed requirements. Of particular interest is IZM-ASSIDs »silicon flex interposer approach« that will be enhanced and optimized to allow the use at low temperatures with superconductive (high frequency) wiring and highly dense connections including the linked manufacturing technologies.