Semiconductor technology modules for quantum computing, AI and the Internet of Things (TO.QI)

The rapidly growing demand for computing power, particularly in relation to quantum computing, artificial intelligence and “Internet of Things” (IoT) applications, urgently requires new microelectronics solutions to counteract the associated drastic increase in energy consumption and reduce greenhouse gas emissions.

One promising solution for this is new computing architectures based on non-volatile memory components, which enable compute-in-memory / neuromorphic computing, as well as the most compact possible integration of different systems. The latter can be achieved through heterointegration. 3D integration via an interposer or the quasi-monolithic integration of several chiplets are particularly promising for quantum computing systems and IoT sensor edge solutions.

The aim of the TO.QI project is therefore to develop such technology modules, which should enable research-oriented pilot production of new components and heterointegration methods.

Fraunhofer IZM ASSID is responsible for technology module 3 (TM3).

The overall goal is to develop a scalable packaging platform for highly integrated quantum computing based on a rigid-flex interposer, which includes two thermally decoupled areas that are electrically connected by high-density superconducting wiring, vias, and chip connections. These technologies to be developed should ultimately enable the manufacture of custom solutions for controlling quantum processors with more than 10,000 qubits in a cryogenic environment with minimal power consumption.

Research Objectives:

• Development of the sub-technologies superconducting TSVs and multilayer superconducting wiring in polyimide, as well as superconducting bump connections at 300 mm wafer level
• Fabrication of the interposer and assembly and testing of the entire package