Fraunhofer Institute for Reliability and Microintegration IZMThe rapidly growing demand for computing power, particularly in relation to quantum computing, artificial intelligence and “Internet of Things” (IoT) applications, urgently requires new microelectronics solutions to counteract the associated drastic increase in energy consumption and reduce greenhouse gas emissions.
One promising solution for this is new computing architectures based on non-volatile memory components, which enable compute-in-memory / neuromorphic computing, as well as the most compact possible integration of different systems. The latter can be achieved through heterointegration. 3D integration via an interposer or the quasi-monolithic integration of several chiplets are particularly promising for quantum computing systems and IoT sensor edge solutions.
The aim of the TO.QI project is therefore to develop such technology modules, which should enable research-oriented pilot production of new components and heterointegration methods.
