Fraunhofer Institute for Reliability and Microintegration IZMAPPLAUSE ECSEL
Developing packaging and interconnection technologies for the competitive production of highly integrated microelectronic and optoelectronic systems.
Projects
Project information
Duration: 01.10.2020 - 31.04.2022
Project website: https://www.elektronikforschung.de/projekte/applause
Project Partners
- DustPhotonics
- albis
- Almae