Material dosing
One integral part of the process chain is the material dosing equipment for contact materials for SMD assembly, structural adhesives, or encapsulation materials. Printing, dispensing, and jetting are the key processes, with jetting allowing contactless and freely programmable application with great potential for industrial use. Challenges remain concerning rheology and particles depending on the chosen materials. Current research into precision dosing is exploring the dosing media’s structure and property correlations, possible improvements to the process to reliably achieve minimal material deposition of less than < 100 µm for pasty materials, and the improvement of process stability writ large.