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Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM
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System Integration & Interconnection Technologies
Services
Manufacturing & Prototyping
Manufacturing & Prototyping
System Integration on Flexible and Rigid Substrates
Chip on Board
Diebond, Pick and Place
Die and Wire Bonding for High Frequency Applications
Technologies for Bioelectronics
Deposition & Structuring of Biocompatible Polymers
Deposition & Structuring of Thin-Film Metals and ALD-Ceramics
Assembly of Microelectronic Components on Flexible & Rigid Substrates
Balling for SiP / Balling for Interposer
Design, simulation and integration of heat spreaders
Photonics
Fiber Lensing
High-Precision Assembly of Micro-Optical Components
Coating system CREAMET 600 Cl2 S3
Coating system CREAMET 600 Cl2 S3
Laser processing of glass
Two-Photon Polymerization for Optical Connections
LED Spectral and angular analyser
Brightness measurement
Nearfieldgoniometer
Measuring adhesive shrinkage
Spectrum analyser & integrating sphere
Automated laser linewidth and laser phase-noise measurement system