Minimising the thermal resistance of packages by the design and optimisation of cooling concepts, taking into account high power losses, heat flux,and ambient temperatures.
Reliability Monitoring and Management aims at ensuring the reliability of electronic systems. With wide-ranging expertise about standards and excellent metrological equipment we can analyse vulnerability, determine reliability parameters and provide system level assessments.
To identify weak points in the early stages of development, or to obtain the optimum geometry under consideration of external loads, finite element simulation (FE) are applied.
Analytical, Numerical and Experiment-Based Assessment of Electromigration in Electrical Contacts
Analytical, numerical and experiment-based assessment of electromigration and highly interdependent parameters (thermal and surface migration) in electrical contacts for weak spot analysis, design optimization and lifetime prediction
Environmentally compatible product design requires an interdisciplinary approachcovering the entire lifecycle of the product. We offer support with strategic decision-making in the development of electronicproducts.
We combine human-centred design and life-cycle thinking with newest insights from applied research to develop sustainable technologies & products, as well as business, service and ecosystem solutions.
Fraunhofer Institute for Reliability and Microintegration IZM