MS Teams / March 04, 2025, 16:00 - 16:45 CET
Packaging using PCB embedding for compact, robust sensor technology in maritime applications
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#1 session of our series »Electronic Solutions for Challenging Environments« // SPEAKER: Dr. Martin Hempel // In order to be able to use electronics where they are needed and to achieve maximum performance, the packaging of the individual components into an overall system is crucial. The expert session will give an insight into the technologies available at Fraunhofer IZM and then focus on embedding technology and demonstrate its application using the example of extremely challenging environments in maritime use.
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