Process and Product Development

The increasing development of high power LEDs on the one hand and the extreme cost pressure for standard LEDs on the other hand cause a use of the LED modules at the limit of their loading capacities. Insufficient reliability analysis , incomplete process transfers, faulty workmanship, critical environment, or usage failures cause malfunctions over and over again. The reasons for this are diversified:

• delamination of glued dice
• lift of wire bonds
• short cuts across the junction
• delamination of the encapsulant
• oxidation/corrosion inside the package
• defects of the LED die itself
  

Often quick results are needed, to prevent recourse claims and lose of the corporate image. We focus the failure scenario as well reason. We use a wide range of equipment and have a comprehensive knowledge to find the failure reason prompt and accurate in most cases:

• cross section with optical and SEM analysis
• elementary analysis (EDX , ESCA , X-ray fluorescence)
• X-ray microscopy
• junction temperature measurement
• characteristic curves
• Focused Ion Beam (FIB)
• Computer Tomography (CT)
• Scanning Acoustic Microscopy (SAM)
• Laser Scanning fluorescence microscopy