Fraunhofer Institute for Reliability and Microintegration IZMOur technology portfolio includes TC and TS flip-chip and die bonding on board, package and wafer level for LEDs, optical & RF components, power electronics, 3D stacking, and hermetical sealing.
- Lead-free reflow solders
- Nano-alloying of solders and fluxes
- Wetting, spreading, solidification
- Fluxless bonding approaches
- Ag sintering and transient liquid phase bonding
- Porous nanosponge as compressible bonding layer
- Reactions with barrier and wetting layers
- Phase transformation
- Growth of intermetallic compounds
- Diffusion and electromigration