Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

Key Research Areas

Advanced IC Design

Our department designs integrated circuits that illustrate the possibilities of innovative packaging technologies and chip-package co-design, using a wide range of semiconductor and MEMS technologies with structure widths of 90nm to 350nm. We also design analog/mixed-signal circuits for power control, energy harvesting, sensor technology and for RF applications. These customized solutions achieve miniaturization and low-power parameters not feasible with conventional ICs. Furthermore, special technologies for applying special materials such as piezo-ceramics allow us to produce integrated systems for smart power, smart sensor and smart actuator applications combined with customized integrated electronics. We also use our circuit technology know-how to design and prototype specialized technology such as high-temperature applications.

Projects: Advanced IC Design

Universal control IC for resonance converters

Low-loss power conversion with good EMC parameters is possible with resonance converters designed with innovative components such as piezoelectric transformers.

SELERINHO

Simple IC technologies with bulk isolation are generally limited to temperatures lower than 150°C. Using cutting-edge design methods, we can produce circuits that remain reliable despite rapidly rising power leakages at temperatures up to 175°C. Here we spread the leakage power compensation over surfaces and use high-swing cascade circuits to reduce the voltage over the transistors.