Fraunhofer Institute for Reliability and Microintegration IZMUltimo – ultra-compact, ultra-reliable power module
We are working with automotive manufacturers and suppliers to design and manufacture an ultra-compact power module with double-sided cooling for high power density applications as part of an industry-based research consortium on “Improving energy efficiency using power electronics”, which is funded by the German federal ministry of education and research (BMBF).
The module, which will be integrated into an existing inverter once development has been completed, comprises semiconductors sandwiched between two DCBs. Water cooling, with the cooling agent guided across each side of the module by cooling bodies, maximizes thermal dissipation and minimizes overall thermal resistance.
The development work employed innovative interconnection techniques, including: Transient liquid phase bonding (TLPB), with which a solid, temperature-resistant, yet thin interconnection layer can be achieved between chip and substrate. Apart from improved stability, the technique ensures that the maximum chip temperature is no longer limited by the packaging
