Technologies for Bioelectronics

Tiny implants with a compact 3D layout, with all components that give the system its intelligence integrated on the device
© Fraunhofer IZM
Tiny implants with a compact 3D layout, with all components that give the system its intelligence integrated on the device

We design and fabricate active neural interfaces. We integrate small custom-designed electronics into microsystems for stimulation of and recording from the neural tissue. Our microsystems are often flexible implants based on biocompatible materials tailored for the central or peripheral nervous system. We design, fabricate, package and test our implants for long-term use. We also investigate new approaches for neural stimulation and wireless power transfer.

  • flexible electrode fabrication for neural stimulation and recording
  • protection of active implantable devices based on soft materials
  • ultrasound wireless power transfer for deep implants
     

Key Research Areas

Packaging technologies for bioelectronics

Technologies for Bioelectronics
© Fraunhofer IZM

Investigating a variety of non-hermetic packaging solutions for implantable electronic devices with a view to maximizing the safe operational lifetime within the body.

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Integration & interconnection of components on biocompatible polymer substrates

Technologies for Bioelectronics
© Fraunhofer IZM

Developing platform technologies to integrate a variety of components into intelligent neural implants on soft substrates.

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Electric & ultrasound neuromodulator system design

tsr-2 PU-based acoustrode / PU-basierte Akustrode
© Fraunhofer IZM

Investigation of electric and acoustic neuromodulation modalities, aiming to increase the energy efficiency and spatial selectivity of the stimulation.

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US power transfer & communication for implantable devices

Technologies for Bioelectronics
© Fraunhofer IZM

Exploring the possibilities for wireless power transfer and communication through ultrasound.

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Team und Kontakt

Dr. Joshua Wilson
Dr. Joshua Wilson

Dr. Joshua Wilson

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

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Andrada Iulia Velea
Andrada Iulia Velea

Andrada Iulia Velea

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-716

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Konstantina Kolovou-Kouri
Konstantina Kolovou-Kouri

Konstantina Kolovou-Kouri

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

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Lukas Holzapfel
Lukas Holzapfel - Fraunhofer IZM

Lukas Holzapfel

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

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Raphael Panskus
Raphael Panskus

Raphael Panskus

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-716

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Stefan Tornedde
Stefan Tornedde

Stefan Tornedde

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-716

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Fraunhofer-Publica

Publications

Here you will find further literature on the topic of bioelectronic technologies

Scientific assistants

Alumni