Wire bonder:
F&K Delvotec G5:
- G5 – 64000
- G5 – 64000 DA (deep access)
- G5 – 64000 Heavy Ribbon
- Laserbonder M17LSB
Kulicke & Soffa:
- Maxμm Ultra
- ProCu IConn
- Orthodyne 3600R Plus
Hesse:
Testing:
Pull- and sheartester Dage:
- XYZTEC Condor Sigma
- Light microscope and stereomicroscope
- Scanning electron microscope (SEM)
- Focused Ion Beam (FIB)
- Roughness measurement
Ultrasonic Welding:
Die bonder:
- Finetech fineplacer
- Hilpert HilBond db750
- Datacon evo - apm 2200
Life-Time-Testing
- Mechanical Fatigue Tests
- Surface Analysis (Material, Roughness, Contamination)
- Interface Analysis down to the nm-Scale
- Failure Analysis and Reliability Studies
- Active Power Cycling (APC)
Flyer - Download
Advanced Chip and Wire Bonding
Fraunhofer Institute for Reliability and Microintegration IZM
