Fraunhofer Institute for Reliability and Microintegration IZM
- Silicon interposer test wafer with front- and backside patterning, sample 50x80 mm
- Copper filled TSVs 10x100 µm
- 1 frontside, 1backside metal layer
- Polymer RDL with 3µm copper and 5 µm WPR
- HF test structures dedicated for material characterization up to 110 GHz
- In cooperation with DFG - German Research Foundation