Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

Virtual tour

Cutting-edge equipment for the research of tomorrow – buzz on in for a fly-on-the-wall, self-guided tour of Fraunhofer IZM’s newest equipment

Innovation Center AdaptSys

On September 1, 2015, the new research and development center »AdaptSys – Multifunctional Microelectronics for Innovative Micro- and Nano-Integration Technology in the Development of Application-Oriented Systems« will open its doors at Fraunhofer IZM in Berlin. The center is being funded by the European Union, the Land Berlin, the BMBF and the Fraunhofer-Gesellschaft and will foster the development of highly complex electronic systems for different areas of application. Furthermore, system integration technologies can be evaluated down to the nanometer scale and their reliability can be tested using new test and qualification processes.

AdaptSys will focus on four main topics:

 

  • Nano-scale process and material development
  • Researching, developing and qualifying innovative system integration techniques adapted to the needs of individual applications
  • Supporting the industries that employ these technologies with product development
  • Failure analysis, quality and reliability assurance, lifetime prediction models and condition monitoring

Merging electronics and application into one

To find out how it works and what exactly the AdaptSys Innovation Center contributes, watch the video

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System Integration

Substrate Line
 

In the substrate area panel-size substrates with a size of 460 x 610 mm² can be prepared for resist and PCB lamination, solder resist and cover lays can be applied and developed after exposure. In our bonding lab high-precision module assembly is carried out under inert gas. New equipment in the 480 m² clean-room allows surface preparation for assembly at reduced bonding temperatures.

Our services include:

  • Embedding of passive and active components
  • Multilayer lamination of PCBs substrates
  • Realization of smallest vias, mechanically as well as with a laser
  • Quality assessment and X-ray microscopical analysis


Wire Bonding Lab
 

  • Processing of Au-, Al- and Cu-based bonding wire materials for thin and heavy wire bonding
  • Assembly of power modules using Al/ Cu- and Cu-heavy wires for quality and reliability analyses
  • Assembly of sensor packages using Cu-ball/ wedge bonding for lead frames and Au/ AlSi1 wires for chip-on-board (COB) processes


Soldering Lab
 

  • Vapor phase soldering in combination with vacuum enables the manufacturing of void less large area solder joints for power electronics.
  • Fluxless soldering of printed circuit assemblies (PCA) using active gas in oxygen free Nitrogen or vapor phase atmosphere
  • Hermeticity test
  • Leak testing including Helium bombing up to a pressure of 10 bar


Photonics Lab
 

  • Laser structuring of glass layers with optical waveguides for electro-optical boards (EOCB)
  • Shack-Hartmann-characterization of micro lenses and micro lense arrays
  • Optical and thermal characterization of LEDs and LDs
  • Research and development of optical packaging processes with an accuracy of up to 0.5 μm

 

Mold Encapsulation Lab
 

The mold encapsulation lab offers various encapsulation processes, related material and package analysis and reliability characterization tools as a one-stop-shop.

  • Compression molding on module-, pression molding on
  • Compatibility to PCB-based and thin film RDL application
  • 3 D-redistribution by through mold vias (TMV)
  • Transfer molding of leadframe-based SiPs and of SiPs organic substrates (MAP molding)
  • Rapid tooling for feasibility studies with real live prototypes
  • Transfer molding of large volume packages
  • Rheological assessment of mold compounds
  • Sensor packages with exposed sensor areas by film molding
  • Transfer to industrial production is guaranteed due to use of production equipment

Material Analysis

AdaptSys has considerably enhanced Fraunhofer IZM’s material analysis competences in the micro-nano transient area. A »PicoIndenter« allows the in-situ emperimental REM investigation of the microscopic material behavior. Focused Ion Beam technology (FIB) enables high-resolution structural analyses on the nanometer-scale of 3D packages. EBSD-EDX micro analysis software facilitates a deeper understanding of compound materials‘ structure-property correlation. A high resolution EDX-detector with 80 mm² provides fast processing of element analyses.


Moisture Lab
 

  • Comprehensive simulation-based reliability assessment of humidity-induced phenomena in micro-electronic components and systems
  • Evaluation of surface properties and thin layers through REM, especially under the influence of water with JPK‘s »NanoWizard 3« Bio-AFM
  • Analysis methods for sorption, permeation and diffusion of water in materials
  • Investigation of humidity-induced swelling behavior and the change in thermo-mechanical and dielectric properties
  • Molecular-dynamic simulation


Long-term testing and Reliability Lab
 

  • Fast temperature cycling tests in the range from -65 °C to 300 °C
  • Temperature storage up to 350 °C


Power Lab
 

  • Characterization of power modules and power electronic devices
  • Active cycling of power modules for lifetime assessment
  • Calorimetric measurement of the effectiveness of highly efficient devices

Design

Advanced System Engineering Lab
 

  • Measuring station up to 50 GHz for antennas and antenna systems
  • RF Lab
  • Dielectric material characterization 1
  • MHz up to 170 GHz
  • Measuring electrical properties of digital data transfer systems (up to 32 Gbit/s)
  • Localising EMC-hot spots with near field probe up to 6 GHz
  • Investigation of RF-properties of active and passive systems (impedance up to 3 GHz / S-parameter measurement up to 220 GHz)