Fraunhofer Institute for Reliability and Microintegration IZMemc3D
Semiconductor 3-D Equipment and Materials Consortium
The mission of the international consortium EMC3D is to rapidly develop a cost-effective and manufacturable TSV (thru-silicon-via) for 3D chip stacking and MEMS integration. Technology support for the consortium goals is from associate members Fraunhofer IZM (Department High Density Interconnect and Wafer Level Packaging), SAIT (Samsung Advanced Institute of Technology), KAIST (Korea Advanced Institute of Science and Technology) and TAMU (Texas A&M University). Material members include Rohm and Haas, Honeywell, Enthone, and AZ with wafer service support from Isonics. Equipment companies initiating the consortium are Alcatel, EV Group, Semitool, and XSiL. For further information please visit http://emc3d.org