Events

The Electronic Components and Technology Conference (ECTC) brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. This year’s conference will be taking place from May 27 to May 30, 2025 in Dallas, Texas. Fraunhofer IZM will present current trends in the field of electronic packaging at the accompanying trade exhibition.

With several oral presentations and two special-sessions in the conference program Fraunhofer IZM scientists will be out in force to showcase the institute’s expertise in all areas of microelectronic packaging.