Events

Don't miss a visit to the stand of the Research Fab Microelectronics Germany!

Under the motto “GreenICT”, the players will be demonstrating the approaches needed to make high-performance electronics production more sustainable in the future.

Fraunhofer IZM has a few highlights up its sleeve:

Reliable power converters for renewable energy

Project Power4re

The objective of the power4re project was to develop effective solutions to increase the reliability and robustness of converters for decentralized electrical energy conversion. The inverters used for grid feed-in in solar parks and frequency converters in wind turbines (hereinafter referred to simply as “converters”) are exposed to particularly challenging operating and environmental conditions. Today, they are among the most frequently failing system components, causing considerable costs.

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Offshore Wind Farm
© Fotolia

Environmentally friendly conductor tracks made of liquid metal for strain gauges

System-on-Flex

Reliability tests accompany the development of new processes. In addition to mechanical testing methods, moisture and thermal tests according to various standards, combined tests adapted to application conditions are also used. We also offer customized conditions for reliability tests.

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Ausstattung Reliability tests
© Fraunhofer IZM

Stretchable circuit board patch for ECG

Project Applause

SMART PATCHES, which can be used for vital signs monitoring, are now available on the market and are used for a variety of useful clinical applications. This has already led to a paradigm shift in the diagnosis of multiple diseases - e.g. atrial fibrillation.

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Pflaster, Function demonstrator with 2 SiPs on SCB
© Fraunhofer IZM | Volker Mai

Thin glass package for quantum chip

Quantum photonic packaging

As the 21st century is entering its third decade, we are witnessing a second quantum revolution, powered by such quantum-mechanical phenomena as superposition, quantum entanglement, and interference. Superposition suggests that a quantum particle, isolated from its environment, can exist in any combination of quantum states at the same time: different energy levels, spin, polarization, or even positions in space.

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Grafik - Quantum Photonic Packaging
© Fraunhofer IZM
 

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

 

Conference | September 11 - 13, 2024

IEEE ESTC 2024 comes to Berlin!

The 10th IEEE Electronics System-Integration Technology Conference will be taking place in Berlin from September 11-13, 2024. IEEE ESTC is the premier international event in the field of electronics packaging and system integration, including their application in industry.