Session on “Data Center Interconnects” at Photonics Days Berlin Brandenburg

Hybrid event / October 04, 2021 - October 07, 2021

Session on “Data Center Interconnects” at Photonics Days Berlin Brandenburg

In order to bring the costs down to €1/Gb/s or even lower in mass production, a holistic transformation to the assembly and characterization of high-speed photonic transceivers is required.

Take part in this year’s virtual conference session and find more information on the Photonic Days Berlin Brandenburg 2021 (October 4 – 7):

Photonics are at the heart of many other innovations.

Without photonics there are no computers, no internet, no cloud as we know it.
Without photonics industry 4.0 will stay at 3.0.
Without photonics there will be no self-driving vehicles.

Berlin Brandenburg is one of the innovation hotspots in very diverse fields of Photonics, optics, microsystems technologies and quantum technologies. Berlin Brandenburg is also a start-up hotspot in digital and also photonics based technologies.

During Photonics Days Berlin Brandenburg we want to discuss the latest tech developments, manufacturing and testing challenges and market opportunities with the international community.

The 5th Photonics Days Berlin Brandenburg – international innovation conference wants to bring the regional and international photonics community together. Its goal is to connect participants from different sectors and regions, so that they cooperate to innovate and create value for new photonics-based value chains together.

Website: https://photonics-days-berlin-brandenburg-2021.b2match.io

Event details

Program

Session: Data Center Interconnects - Towards mass manufacturing

Registration

https://photonics-days-berlin-brandenburg-2021.b2match.io/

Click here to enter the Session „Data Center Interconnects on October 5, 2021 from 3-6 pm (CET)

Location

Berlin-Adlershof | WISTA, Germany

Date

October 04, 2021 - October 07, 2021

Download this event as iCal

Language

English

Session details

Tuesday, October 05, 2021 | 15:00 - 18:00

Chaired by:
Benjamin Wohlfeil, ADVA
Paraskevas Bakopoulos, Mellanox / NVIDIA Networking
Bogdan Sirbu, Fraunhofer IZM

A holistic transformation to the assembly and characterization of high-speed photonic transceivers is required towards bringing the cost down to €1/Gb/s or even lower in mass production.

In order to surpass the cost metric threshold the usage of enhanced and scalable techniques is the focus, such as

glass interface based laser/PIC and fiber/PIC coupling approaches, leveraging glass waveguide technology to obtain spot size and pitch converters in order to dramatically increase optical I/O density,
while facilitating automated assembly processes,
3D packaging (TSV) enabling backside connection of the high speed PIC to a Si carrier,
a new generation of flip chip bonders with enhanced placement in a complete assembly line compatible with Industry 4.0 which will guarantee an x6 improvement in throughput and
wafer-level evaluation of assembled circuits with novel tools that will reduce the characterization time by a factor of 10, down to 1 minute per device.

Such process flow is assessed with the fabrication and characterization of demonstrators, addressing the mid-term requirements of next generation transceivers required by Data Center operators and covering both inter- and intra- Data Center applications.

The Session is organized in cooperation with MASSTART Consortium and OpTecBB.

Agenda

15:00 – 15:05

Paraskevas Bakopoulos, Mellanox / NVIDIA Networking, Israel

Welcome and Introduction

15:05 – 15:20

Katarzyna Ławniczuk, Bright Photonics BV, Netherlands

Develop your custom Photonic Integrated Circuits for Data Centers

15:20 – 15:35

Quentin Wilmart, CEA-Leti, France

Advanced silicon photonics platform for high data rate transceivers

15:35 – 15:50

Sofiane Belahsene, Almae Technologies, France

III-V optical sources for high bit rate fiber transmission

15:50 – 16:05

Adrien Billat, Teem Photonics SA, France

Latest developments in glass-based photonic circuits and assemblies

16:05 – 16:20

Bogdan Sirbu, Fraunhofer IZM, Germany

3D integration for next generation transceiver PICs

16:20 – 16:35

Benjamin Wohlfeil, ADVA Optical Networking SE, Germany

PICs for data center interconnects

16:35 – 16:50

Boaz Atias, Mellanox / NVIDIA Networking, Israel

Terabit transceivers for the datacentre and high volume manufacturability

16:50 – 17:05

Moritz Seyfried, ficonTEC Service GmbH, Germany

Integration of assembly process of high-speed photonic transceivers into a standard manufacturing system as basis for mass manufacturing

17:05 – 17:20

Stelios Pitris, Aristotle University of Thessaloniki, Greece

Testing automations of high speed silicon photonic transceivers for data center interconnect applications

17:20 – 17:35

Ali Emsia, Tektronix GmbH, Germany

Accelerating Transceiver Characterization and Verification

17:35 – 18:00

Paraskevas Bakopoulos, Mellanox / NVIDIA Networking, Israel

Discussions

Events

Hybrid event / October 04, 2021 - October 07, 2021