Fraunhofer IZM’s Center „All Silicon System Integration Dresden - ASSID“ presented its 3D-activities at the „European 3D TSV-Summit”, organized by SEMI Europe in Grenoble. The theme of the first-ever summit was "On the Road towards TSV Manufacturing“.

Fraunhofer IZM not only sponsored the event but was also a member of the organizing committee. IZM colleagues contributed several presentations to the event and also had an exhibition booth. Here the institute’s activities in the realm of 3D packaging with through silicon vias met with particular interest.