35 experts from science and industry gathered at Fraunhofer IZM in Berlin on Nov, 17, 2009 to learn about the possibilities of chemical silver as surface metallization.

Mixed mounting of COB, flip chip and SMD is steadily increasing, however hardly any metallization systems are available that can be used for all these technologies. The workshop showcased chemical silver (immersion Ag) as a robust and cost-effective alternative for COB applications.

Current trends in component integration and in particular concerning development and requirements in COB technology were presented. The use of chemical silver as a surface finish, as well as the associated technologies (soldering and gluing on chemical silver, Au-TS wire bonding, and encapsulation) met with particular interest from the participants and was discussed at great length.

For further information (in German), please see the brochure on the left.

Now available:

The workshop proceedings “Chemical silver - cost-effective and reliable finishes for the next generation of circuit boards” (in German) for € 125. The booklet contains the slides of all the workshop presentations.