Fraunhofer IZM scientist Andreas Ostmann took home the Best Paper Award at the 20th European Microelectronics and Packaging Conference (EMPC 2015). Ostmann and his co-authors Christian Boehme, Kai Schrank und Klaus-Dieter Lang received the award for their paper “Development of a Microcamera with Embedded Image Processor Using Panel Level Packaging”. The award was presented at the end of the conference by technical chair Markus Detert and general chair Martin Schneider-Ramelow.

More than 300 professionals from around the world gather every other year to discuss the latest issues in packaging at the EMPC Conference. This year’s event took place in Friedrichshafen on Lake Constance from September 14 - 16.