Award
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The Fraunhofer cluster 3D Integration headed by the Fraunhofer IZM-ASSID institute has won the coveted “2016 3D InCites Award for Excellence in 3D Packaging Technologies” in the “Research Institute of the Year” category at this year’s SEMICON West expo.
![Fraunhofer Cluster 3D Integration honored with the InCites Award Fraunhofer Cluster 3D Integration honored with the InCites Award](/en/news_events/tech_news/fraunhofer-cluster-3d-integration-mit-incites-award-geehrt/jcr:content/fixedContent/pressArticleParsys/textwithinlinedimage/imageComponent1/image.img.jpg/1469086039983/CnRUokFVUAAH0gA-jpg-large.jpg)
M. Jürgen Wolf, Chairman of the Fraunhofer-Cluster 3D Integration (left), together with other 2016 3D Incites Award winners
Beating the other high-profile candidates Leti (France) and IME (Singapore), the cluster and its constituent institutes IZM-ASSID, ENAS, IKTS, IIS/EAS, and IPMS gained international recognition for the exceptional research achievements in the field of wafer-level 3D system integration. The cluster’s chairman M. Jürgen Wolf received the award on behalf of the cluster on 12 July 2016.
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