With this honor, the world’s leading engineers’ association recognizes Professor Lang’s long track record of excellent scholarship in the field of packaging and the heterogeneous integration of microelectronics. Lang already headed the German chapter of one of the IEEE’s societies – today’s Electronics Packaging Society (EPS) – between 2008 and 2014 and continues to play a substantial role in the successful development of the IEEE with his scholarly contributions and international networking efforts.

Fellowships at the IEEE have been proffered by the Board of Directors for over a century; only 0.1 percent of its many members around the world are chosen for this prestigious honor every year.

In addition to the IEEE’s fellow grade, Professor Lang has already received the Fraunhofer Medal for his exceptional contributions to science and research and the IMAP’s William D. Ashman Achievement Award for Electronic Packaging and System Integration. He is also a fellow and life member of IMAPS.
Professor Lang is a prolific author and contributor of four monographs and more than 350 other publications on assembly and interconnection technology, packaging, microsystems, and system integration.