Soldered and sintered interconnects, but also bumping technologies and life cycle issues – these topics were in particularly high demand at Fraunhofer IZM‘s booth at SMTconnect. Europe‘s leading trade fair for system integration in microelectronics was the focus of discussions on design, PCB production, components, assembly and interconnection technologies and test equipment, not least thanks to the »Future Packaging« production line.

Fraunhofer IZM was also represented at PCIM (Power Conversion Intelligent Motion) Europe at the same time. Here, visitors were introduced to Fraunhofer IZM‘s complete range of services in the field of power electronics: from system design, packaging and interconnection technology for power electronic systems and reliability aspects to cooling concepts. A special highlight was a live demonstration in the form of a measuring chamber, which measures switching losses of widebandgap semiconductors under real conditions and without additional parasitic effects.