Dr. Rainer Dudek erhielt auf der 9th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), die in Shanghai / China am 28.-31.08.2008 stattfand, den NXP Semiconductors Best Paper Award für seinen Beitrag "FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings"

(Co-Autoren E. Kaulfersch, S. Rzepka, M. Röllig, B. Michel)