This prestigious award was presented to him on October 1^st 2024 by IMAPS First Past President and Awards Committee Chair, Dr. Beth Keser, during the award presentation ceremony at the 57th International Symposium on Microelectronics in Boston, MA, USA.

Professor Ndip has been contributing to the education of university students and training of engineers and scientists in the microelectronics packaging industry for over 15 years.

He developed and taught the first courses that focus on signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) of electronic packaging technologies in microelectronic systems at the Technische Universitaet (TU) Berlin in 2008. In these courses, students were taught the fundamentals of electromagnetic theory and high-frequency engineering required for in-depth understanding and analysis of the root causes of SI, PI and EMC issues in electronic packaging. He also offered laboratory courses, and introduced the students to practical aspects of electromagnetic modeling and high-frequency measurement techniques. He taught the courses for 11 years (2008-2019) and helped prepare the students for research and development (R&D) careers in the microelectronics packaging industry. 

The courses he currently teaches at the Brandenburg University of Technology (BTU) Cottbus-Senftenberg are also designed to provide students with solid theoretical and practical foundations for a successful career in academia and industry

Professor Ndip has mentored, advised and supervised over a hundred Bachelor, Master and PhD students. He has also been teaching Professional Development Courses (PDCs) to hundreds of engineers and scientists for more than 15 years. His outstanding publications and inventions have been widely used in the education of university students and in the training of professionals in the microelectronics packaging industry worldwide.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies worldwide.

Short Bio

Ivan Ndip is a full Professor at the Brandenburg University of Technology (BTU), Cottbus-Senftenberg in Germany. He is also with Fraunhofer IZM, where he has been working since 2000. At IZM, he currently leads the Department of RF & Smart Sensor Systems in Berlin and the IZM Branch Lab for High-Frequency Sensors and High-Speed Systems in Cottbus. While working at IZM, he also served as a Lecturer at the Technische Univeristaet (TU) Berlin from 2008 to 2019.

He is the author and co-author of more than 250 publications in referred journals and conference proceedings, and has more than 35 German, European and US patents. His research has been honored with numerous national and international awards.

Professor Ndip is a Fellow and Life Member of IMAPS as well as a Senior Member of IEEE. He served on the Executive Board of IMAPS as Director from 2016 to 2020. 

He studied electrical engineering and obtained his Dipl.-Ing. (M.Sc.), and Dr.-Ing. (PhD) with the highest distinction (summa cum laude), in 2002 and 2006 respectively from TU Berlin. In 2017, he received his second doctorate degree, Dr.-Ing. habil., also in electrical engineering from BTU Cottbus-Senftenberg.