At the ITherm 2008 Bernhard Wunderle, Christine Kallmayer, Hans Walter, Bernd Michel and Herbert Reichl were honoured with the Best Paper Material Track for their excellent paper "Lifetime Model for Flip-Chip on Flex Using Anisotropic Conductive Adhesive under Moisture and Temperature Loading".

The prize in the Emerging Technologies Track also went to colleagues from Fraunhofer IZM - here Thomas Brunschwiler, Hugo Rothuizen, U. Kloter, Bernhard Wunderle, Hermann Oppermann, Herbert Reichl and Bernd Michel were honoured for their paper "Forced Convective Interlayer Cooling in Vertically Integrated Packages".

ITherm is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2008 was held in Orlando, Florida.