Trainings and Workshops

In order to turn individual electronic components such as microchips, diodes, resistors, connectors, displays etc. into a functional system, they must be connected. There are a variety of so-called packaging technologies - such as soldering, gluing, PCB lamination - which can be used for this purpose. The use of the individual technologies must be coordinated so that, for example, non of the already existing system components are damaged. Due to the ever-increasing integration densities, these different technologies are also moving closer together in purely spatial terms and the interactions are becoming stronger. For this reason, the development of a complex system with demanding boundary conditions requires a partner who can combine expertise in all essential assembly and connection technologies. This partner is Fraunhofer IZM. Here, an application-specific process chain can be put together from the individual technologies and implemented in prototypes.

One technology that IZM has been working on for decades with partners from industry is the embedding in organic substrates. Here, particularly compact and powerful systems can be constructed cost-efficiently by integrating active and passive electronic components into the inner layers of printed circuit boards (PCB). High-frequency materials can also be used for communication applications and high-performance computing. The possibility of arranging components 3-dimensionally in relation to each other means that connection lengths and the associated losses can be drastically reduced. Furthermore, heat conduction can also be adapted in all directions around the embedded components, resulting in decisive advantages for circuits with high heat generation, such as power electronics. In addition, the integration of the electronics inside the PCB automatically provides very good protection against environmental influences. For the use of sensor technology under particularly harsh conditions, this protection can be further increased without sacrificing the advantages of the system's compactness. The presentation will focus on application examples from the maritime environment. Here we have special stresses due to pressure, temperature, (salt) water, salt spray and mechanical loads.