Trainings and Workshops

At our R&D institute, we are deeply engaged in pioneering work on glass core substrates, a critical technology for electrical and future optical applications. Our teams “Embedding and Substrates - EST” and “Optical interconnect Technologies - OIT” focus on harnessing the exceptional properties of glass, such as its low, Si-near coefficient of thermal expansion and superior optical transmission, to advance the capabilities of photonic integrated circuits.

We are committed to pushing the boundaries of what glass core substrates can achieve, aiming to overcome current limitations of processes to produce these substrates to enhance data transmission speeds and mitigate signal loss found in traditional silicon-based platforms.

Our research emphasizes refining the manufacturing processes even for large scaled 510 x 515 mm² substrates to ensure they are economically scalable and compatible with existing electronic and future photonic systems. By integrating these substrates into next-generation photonic devices, we aim to significantly reduce latency and power consumption, paving the way for ultra-fast, efficient communication networks. Through dedicated innovation in fabricating the substrate with TGVs, multilayer RDL and optical waveguides, we are laying the groundwork for technologies that will drive the future of high-speed, high-bandwidth communication.